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Using the latest in technology and methods, we are one of a few select companies in Europe involved in the manufacture of Semiconductor process tooling.

Materials and surface treatments are critical to these applications, and our experience enables us to offer valuable advice on tool life and suitability. Services provided include:-

  • Wafer processing aids
  • Wire bond
  • Trim and form (single op and progressive)
  • Singulation
  • BGA tooling
  • Storage and handling (waffle trays)

Further to these, we also manufacture components for the production of equipment which provide advanced wafer processing technologies for the microelectronics industry. End-markets include micro-electromechanical systems (MEMS), LED, high speed RF device IC’s and power semiconductors. These components, in many cases extremely complicated, are machined under strict quality-controlled conditions.

For more information on our services or to arrange a free quotation please